Such expandable SRAM and modular computing applications are enabled by GUC GLink-3D high bandwidth, low latency, low power, and point-to-multipoint interface between 3D stacked dies ... ASIC customers ...

However, HBM is a stacked-die memory, not a monolithic die like 3D NAND flash ... of 4F2 (where F is the minimum feature size). This design employs a vertical-channel transistor and moves from ...