However, HBM is a stacked-die memory, not a monolithic die like 3D NAND flash ... of 4F2 (where F is the minimum feature size). This design employs a vertical-channel transistor and moves from ...

S. Lee and L. Sung Kyu, Design and analysis of 3D-MAPS: A many-core 3D processor with stacked memory, Custom Integrated Circuits Conference (CICC), 2010 IEEE, 2010, pp. 1-4. [31] C. Mineo, R. Jenkal, ...

Such expandable SRAM and modular computing applications are enabled by GUC GLink-3D high bandwidth, low latency, low power, and point-to-multipoint interface between 3D stacked ... "3D die stacking ...

The platform allows for SiPs with up to 6000mm² of 3D-stacked silicon ... flexibility for design teams to disaggregate ASIC architecture between top and bottom dies (which is a result of denser ...