来自MSN7 个月
SK hynix says its 3D DRAM is half as expensive to produce — credits EUV chipmaking tools
Today's DRAMs use 6F^2 (6F2) cell design, for example ... Meanwhile, The Elec says that SK hynix is gearing up to wed VCT and 4F^2 (4F2) cell design to make ultra-dense DRAMs (arguably, a risky ...