SE: With all these thermal issues and growing complexity of these multi-die assemblies, are there new kinds of stress testing ...

The GLink 2.0 IP using TSMC 5nm Process and 2.5D Advanced Packaging Technology passed full silicon qualification. Hsinchu, Taiwan – Aug 31, 2021 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, ...

“Below 5nm, structural complexity significantly complicates defect detection,” said Levin ... The process, essential for achieving ultra-high-density die integration, requires nearly perfect surface ...