Semiconductor Engineering1 年
Impact of Scaling and BEOL Technology Solutions At The 7nm Node On MRAM
In this article, we first study the impact of shrunk interconnect dimensions on MRAM performance at various technology nodes. Then, we investigate the impact of various potential back-end-of-the-line ...
Semiconductor Engineering26 天
3D Stacked Device Architecture Enabled By BEOL-Compatible Transistors (Stanford et al.)
A new technical paper titled “Omni 3D: BEOL-Compatible 3-D Logic With Omnipresent Power, Signal, and Clock” was published by researchers at Stanford University, Intel Corporation and Carnegie Mellon ...