资讯

Design-Reuse2 年
GUC Unveils GLink 2.3LL, The World's Most Powerful D2D Interconnect IP Using 2.5D Technology
The GLink 2.3LL IP using TSMC N5 Process and Advanced Packaging Technologies passed silicon validation. Hsinchu, Taiwan – October 26, 2022 –Global Unichip Corp. (GUC), the Advanced ASIC Leader, ...