芯立汇科技最新专利：基于DBC互连的功率半导体封装方法，或将引发 ...
在同类旗舰产品中，针对市场上已有的多款主流 功率半导体设备进行评测 ，可以发现，芯立汇科技通过其新专利技术，将其产品的性能提升到了一个新的高度。以某知名品牌为例，其使用的传统封装工艺在高负载情况下，往往会导致过热和明显能效损失。而根据权威评测数据显示，通过应用DBC技术后的新成品， 在极限负载情况下能保持低于80℃的温度，且功耗较其竞争对手产品降低了20% ...
芯立汇科技斩获新专利：DBC互连技术助力功率半导体封装创新
在科技创新的浪潮中，芯立汇科技（无锡）有限公司再次引起业界关注。近日，该公司成功获得了国家知识产权局颁发的一项显著专利，名为"一种基于DBC互连的功率半导体封装结构的封装方法"。根据金融界报道，这项专利的授权公告号为CN119092414B，申请日期则是在2024年11月。
What Did You Make Of Dirty Boxing’s Debut?
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2027 Aston Martin DBC Three-Door Crossover SUV Virtually Fights Lambo's EV With ICE Power
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The Arunachal Times13 天
DBC conducts seminar on startups
JOLLANG, 12 Mar: The commerce department of Don Bosco College (DBC) organized its 13th departmental seminar on the theme ‘Government Initiatives for Promoting Startups in Arunachal Pradesh: ...