夏普/NEC最新的LED系列FE3系列预计比传统LED技术耗电量低60%。该供应商在ISE 2025上展示了这一点，在那里他建造了三个总尺寸为440英寸的LED塔。这些屏幕的散热明显低于其他不使用倒装芯片SMD技术的这种尺寸的装置。

Instead of facing up and bonded to the package leads with wires from the outside edges of the chip, any surface area of the flip chip can be used for interconnection, which is typically done ...