在数字化时代迅速发展的今天，人工智能技术的飞速进步对存储芯片提出了更为苛刻的要求，于是HBM(高带宽内存)技术应运而生。HBM以其卓越的高带宽、大容量、低能耗以及小巧的体积等优势，在高性能计算领域中脱颖而出，成为不可或缺的存储技术。 本文将 ...

You could perhaps stretch that further if you had to. All implementations to date limit the physical distance of that interface, so that limits the number of HBM dies that you can fit around the SoC.

Integrating the functionality of the HBM base die into a logic die provides greater flexibility and additional control.

Rambus recently announced the availability of its new High Bandwidth Memory (HBM) Gen2 PHY. Designed for systems that require low latency and high bandwidth memory, the Rambus HBM PHY, built on the ...

The global AI boom is set to keep high bandwidth memory (HBM) in short supply through 2025, as demand surges across AI and data-intensive applications, according to experts at SEMICON Korea 2025.

HBM plays a central role in XPUs, which use advanced packaging technology to integrate memory and processing power. Traditional architectures, however, limit scalability and energy efficiency.