SK hynix begins HBM production expansion: M10F fab re-purposing in operation, aims for 160,000 to 170,000 units per month in ...

Existing designs can be reused since the die is manufactured in the logic process, not the DRAM process. Figure 2 contrasts the HBM and cHBM approaches. Fig. 2: A look at the HBM DRAM stack. cHBM has ...

High-bandwidth memory (HBM) is again in the limelight. At GTC 2025, held in San Jose, California, from 17 to 21 March, SK hynix displayed its 12-high HBM3E devices for artificial intelligence (AI) ...

Hanwha Semitech is poised to expand its supply of thermal compression bonding machines (TCB) for high-bandwidth memory (HBM) production to SK Hynix. Save my User ID and Password Some subscribers ...

Hanmi Semiconductor has increased the price of its thermal compression bonder (TC Bonder; TCB), a critical piece of equipment for high-bandwidth memory (HBM) production, by 25% starting April 1.

On May 14, at the TSMC European Technology Symposium in Amsterdam, TSMC announced plans to use 12-nanometer and 5-nanometer process technologies for the base die of HBM4. HBM, crucial for AI ...

This datasheet describes GUC HBM (High Bandwidth Memory) PHY IP, which could be integrated with HBM memory controller to provide HBM functionality. The HBM PHY is compliant to the JEDEC HBM2E & HBM2 ...

SK Hynix sold out its planned output of HBM chips this year and expects orders for its full production in 2026 to be ...

The samples were delivered ahead of schedule based on SK hynix's technological edge and production experience that have led the HBM market, and the company is to start the certification process ...

The Company's leadership in HBM manufacturing, with a 50% market share in key process steps, ensures it captures substantial market opportunities. Current valuation at a discount offers a great ...