2025年是HBM3E量产竞争白热化的一年，而围绕下一代高带宽存储（HBM4）的竞争已然拉开帷幕。3月19日， SK海力士 宣布全球首发用于 AI ...

2025年将是HBM3E量产竞争的焦点之年，然而围绕其后继者——下一代高带宽存储（HBM4）的争夺战已然拉开帷幕。SK海力士在3月19日荣耀揭示了全球首款12层HBM4样品，专为AI计算而生，已开始向主要客户供货，并预计将在2025年下半年实现量产，这标志着HBM4技术赛道正式进入新纪元。在这个AI计算的黄金时代，高带宽内存（HBM）因其超越传统DRAM的卓越性能而备受瞩目。自2013年首款HBM ...

格隆汇3月26日｜据ZDNet，知情人士透露，SK海力士近期收到了英伟达关于HBM3E 8层产品的追加供货请求，原因是英伟达将H20中使用的HBM产品从HBM3更改为HBM3E，英伟达已决定在今年上半年量产的H20中配备8层HBM3E产品，公司内部将新型号称为H20E。据悉，SK海力士最早将于本月开始为这一请求供货。

OMC – HBM3 Memory Controller is a small & highly configurable IP. It provides high performance through advanced memory controller design based on a proprietary out-of-order scheduling algorithm and ...

SK Hynix Inc. (or "the company") announced today that it has shipped the samples of 12-layer HBM4, a new ultra-high ...

快科技1月21日消息， 研究机构 TechInsights今天表示，其揭示了三星HBM3内存的首个商用实例，该内存集成在AMD的MI300X AI加速器中。 TechInsights称，三星于 ...

GUC integrates proteanTecs’ health and performance monitoring solutions into all its HBM and die-to-die interface test chips. proteanTecs’ technology is now silicon proven in GUC’s 5nm HBM3 PHY, up to ...

SK hynix begins sampling the world's first 12-layer HBM4 memory samples with up to 36GB capacity, 2TB/sec bandwidth: ready ...

The samples were delivered ahead of schedule based on SK hynix's technological edge and production experience that have led the HBM market ... to mass produce HBM3 in 2022, and 8- and 12-high ...

The H200 features 141GB of HBM3e and a 4. ... of HBM3 and a 5.2 TB/s memory bandwidth, which would put it well above the H200 in capacity and bandwidth. Intel, too, plans to ramp up the HBM ...

[Related: Ampere Reveals 256-Core Server CPU, AI Partnership With Qualcomm In Big Update] Whereas the MI300X sports 192 GB of HBM3 high-bandwidth ... than the H200’s 4.8 TBps, according to ...