May 10 /PRNewswire/-- Inapac Technology, Inc., the leading semiconductor company exclusively focused on DRAM for system-in-package (SiP) applications, today announced a breakthrough solution for ...

Today, this is better known as system-in-package (SiP) and has been the standard ... Just a few months later, AMD debuted two multi-chip product lines: Threadripper and EPYC, with the latter ...

There was once a time when only well-established industry heavyweights could design and build bleeding-edge chips. That is no ...

The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.

A technical paper titled “Muchisim: A Simulation Framework for Design Exploration of Multi-Chip Manycore Systems” was published by researchers at Princeton ... In addition to performance, Muchisim ...

As computing shifts from single-chip processors to multi-chip systems, traditional communication methods, such as ...

First introduced in September 2000, the eX family consists of three devices: the eX64, eX128 and eX256 with system gate densities of 3,000, 6,000 and 12,000, respectively. Actel offers a range of chip ...