There was once a time when only well-established industry heavyweights could design and build bleeding-edge chips. That is no ...
As computing shifts from single-chip processors to multi-chip systems, traditional communication methods, such as ...
Today, this is better known as system-in-package (SiP) and has been the standard ... Just a few months later, AMD debuted two multi-chip product lines: Threadripper and EPYC, with the latter ...
The tech integrates 2.5D packaging technology and 3D silicon stacking to usher in the next generation of “superchips” for AI.
High density and complex connectivity introduce new challenges for packaging design and assembly manufacturing validation.
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