We recently published a list of 10 AI News and Ratings Investors Should Take a Look At. In this article, we are going to take a look at where Lam Research Corporation (NASDAQ:LRCX) stands against ...

Wafer Level Packaging (WLP) technologies are at the forefront of semiconductor manufacturing, enabling the integration of multiple components into compact and efficient packages. These ...

The etching and characterization room contains a suite of tools for dry etching and characterization of samples. This includes three dry etchers with a range of capabilities, while characterization ...

Reactive Ion Etch (RIE) is a physical etch process. A rich plasma has been made just above the wafer, and the ions are expedited toward the surface to generate a highly powerful anisotropic etch.

Let us help you with your inquiries, brochures and pricing requirements Request A Quote Download PDF Copy Download Brochure The PlasmaPro 100 Cobra ICP RIE system ...

Summary Pixel-level dose correction (PLDC) enhances mask quality by solving both uniformity and linearity issues in mask manufacturing. Unlike traditional mask process correction (MPC) solutions, PLDC ...

Lam Research posted a second-quarter adjusted profit per share of 91 cents, beating analysts' estimate of 88 cents. The company posted revenue of $4.38 billion for the three months ended Dec.29, ...

TSV technology allows for high-density stacking and direct vertical connections, making it a foundational technology for next-generation chips.