In fact, cost, technical hurdles and cycle time are all contributing to the ongoing slowdown of . Cycle time is the amount of time it takes to process a wafer lot in a fab from start to finish.

The dual-flow concept makes it possible to run each wafer process line independently. Maintenance can be performed while the system is running production, greatly reducing system downtime.

Chip binning' is supposed to be the process of testing newly manufactured silicon to see how many of the important bits work ...

VNNI, claims to have found the wafer near TSMC's Fab 16 factory in Nanjing, China. While not cutting-edge, that ...

The company also announced an even more ambitious technology named System-on-Wafer (SoW) that will allow for 3D stacking of logic and memory directly on top of a 300mm wafer-sized chip.

The company uses molten silicon to form wafers rather than sawing ingots, thus eliminating dust waste and speeding up the process. A spokesperson for the company told pv magazine it is exploring ...

TSMC's cutting-edge 2nm chips to see monthly production capacity of up to 80,000 wafers before the end of the year, Apple ...

Due to the continuous expansion of China's mature process capacity and the ongoing requests from downstream customers for price reductions, the industry is very curious about the wafer pricing ...