
It embeds an MCU (STM32G031x8x3) featuring an Arm 32-bit Cortex®-M0+ CPU and a 250 V triple half-bridge gate driver, able to drive N-channel power MOSFETs or IGBTs. A comparator featuring an advanced smartSD function is integrated in the device, ensuring fast and effective protection against overload and overcurrent.
Title: 98ASA00935D, QFN, THERMALLY ENHANCED, 10 X 10 X 0.9, 0.4 PITCH, 88 TERMINAL Author: NXP Semiconductors N.V. Subject: 98ASA00935D, QFN, THERMALLY ENHANCED, 10 X ...
QFN/DFN 為無引腳設計,一般很難從其外觀的焊錫點來判斷其焊錫性是否良好,目前 QFN/DFN 的焊錫檢查主要用電測 (In-Circuit-Test 、 Function Test) 來偵測其功能,一般也會佐以光學儀器或 X-ray 來檢查焊錫的開、短路不良現象。 功能測試正常, 以顯微鏡檢驗結果引腳側面未爬錫,以X-Ray檢驗結果引腳下方有錫。 QFN/DFN 封裝側面的引腳是 Leaf frame( 導線架)的切斷面,並無電鍍處理,所以很難吃錫, IPC-A-610 並未定義側面引腳要吃錫( 規範中Note 5 說明上圖H 的部位不需吃錫), …
72-Lead Plastic Quad Flat, No Lead Package (NV) - 10x10 mm Body [QFN] With 5.1x5.1 mm Exposed Pad; Punch Singulated
QFN 72 72 Pin QFN Package (10mmx10mm) Notes: 1. Conforms to JEDEC standard JESD-30 MO-220 2. All dimensions are in millimeters Table of Dimensions 72 ... Lid 10x10 : Substrate 10x10 72 : dÐiNPACK A PCB TECHNOLOGIES COMPANY . iNPACK A PCB TECHNOLOGIES COMPANY . Title: QFNPCB_10x10_72_21123
LAN8810I-AKZE Microchip Technology | 集成电路(IC) | DigiKey
来自 Microchip Technology 的 LAN8810I-AKZE – 完全版 收发器 4/4 GMII 72-QFN(10x10)。 DigiKey 提供数以百万计电子元器件的定价和供应信息。
On a 10x10 footprint, GQFN is capable of offering 200 or more I/O as compared to the current limitation of 100 I/O on a 10x10 QFN design. GQFN offers the freedom of design to create an unlimited variety of packages, and can support stacked die, multi-chip, and passive component attach capability using flip chip and/or wirebond interconnection.
KAD5510P-50Q72 Renesas Electronics Corporation | 集成电 …
来自 Renesas Electronics Corporation 的 KAD5510P-50Q72 – 10 位模数转换器 1 输入 1 SAR 72-QFN(10x10)。 DigiKey 提供数以百万计电子元器件的定价和供应信息。
GQFN Package Data Sheet | UTAC Semiconductor Packaging
GQFN is a fully customizable technology that provides a solution to restrictions in package design rules and enables manufacturers to shrink die sizes and benefit from the latest fab technology. On a 10x10 footprint, GQFN is capable of offering 200 or more I/O as compared to the current limitation of 100 I/O on a 10x10 QFN design.
Package Dimensions QFN 88 302-0000-030 Rev. 1.1, 11/5/2009 1 Chrontel Package Dimensions 88 Pin QFN Package (10 x 10 mm) Table of Dimensions
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