The Double Decawatt Package, [1] [2] D2PAK, SOT404 or DDPAK, standardized as TO-263, [3] is a semiconductor package type intended for surface mounting on circuit boards. The TO-263 is designed by Motorola .

PG-TO263-3-2_Package Outline Share. 04_00 | Jun 28, 2023 | PDF | 106 kb. Board Assembly Recommendations (TO) Share. 04_00 | Oct 11, 2021 | PDF | 1.91 mb. 3D Download PG-TO263-3-2 (STP) Share. 01_00 | Apr 06, 2018 | STP | 524 kb. PG-TO263-3-2_Interactive 3D_01 Share. 04_00 | Jun 28, 2023 | STP | 453 kb ...

D2PAK (TO-263) package, MOSFETs manufactured by Vishay, a global leader for semiconductors and passive electronic components.

The TO– 263 THIN Package is a family of surface mount power packages designed with the following features: • Footprint/drop-incompatible with the standard TO-263package but with a thinner and smaller molded body package outline • Qualified using Halogen-Free“Green” Compound • Moisture Sensitivity Level 1 (MSL) at 260° C

Package. PG-TO263-7-12_SPO_PDF Share. 01_00 | Mar 27, 2020 | PDF | 107 kb. Board Assembly Recommendations (TO) Share. 04_00 | Oct 11, 2021 | PDF | 1.91 mb. PG-TO263-7-12_3D_PDF Share. 01_00 | Mar 27, 2020 | PDF | 163 kb. …

TO-263 THIN is designed using the same body size and thickness for all 3, 5, 7 and 9 lead options, see Figure 1. The leads are formed into a Gull-Wing configuration. All TO-263 THIN package leads are Pb-Free compliant. Shipped in non conductive Tape and Reel. Tube form will be available upon special request.

The D2PAK (TO-263) is a surface-mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface-mount package.

Surface Mount - 7000 W - TO-263 Designed to protect sensitive electronics from: -55 to 150 Inductive load switching Alternator load dump Applications Features & Benefits The SLD263 uni-directional TVS diode series is housed in a TO-263 package …

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding. 0.2 mm to the ‘Z’ dimension.

Package Information www.vishay.com Vishay Siliconix Revison: 28-Oct-2024 1 Document Number: 71198 ... TO-263 (D2PAK): 3-LEAD VERSION 1: FACILITY CODE = T Notes 1. Plane B includes maximum featur es of heat sink tab and plastic. 2. No more than 25 % of L1 can fall above seating plane by max. 8 mils. 3. Pin-to-pin coplanarity max. 4 mils. 4 ...