
NVME BGA SSD 采用了全国产化 NVMe 主控,搭配了长江存储的 NAND Flash 芯片。 该模块采用多芯片堆叠封装设计,可实现大容量、高速数据传输等特点。 在航空、航天、车辆
Industrial BGA SSD | Delkin Devices-Rugged Controlled Storage
2023年3月16日 · Delkin’s BGA SSD’s offer performance & reliability in a small form factor footprint that punches well above its weight! Delkin Industrial BGA SSD Product Features: PCIe Gen. 4 x4, NVMe 1.4. Type 1620 (16 x 20mm), 291-Ball. Sequential Read / Write Performance. 256GB: 2950 / 1000 MB/s; 512GB: 3652 / 1900 MB/s; 1TB: 3650 / 2900 MB/s
BGA SSD - Exascend
PCIe 4.0. NVMe 1.4 | 291-ball BGA | 3D TLC; Capacity range from 128GB to 1TB; Up to 5,000 MB/s read and 1,600 MB/s write speeds; Extreme temperature range from -40°C to +105°C; DRAM-less with Host Memory Buffer (HMB) support
BGA SSD | Accelerated Memory Production - ampinc.com
BGA (M.2 1620) PCIe Gen4x4 3D TLC 291-ball SSD AMP, Inc.’s BGA SSDs are designed for automotive, industrial, and consumer applications with exacting standards. Designed to withstand intense vibration and shaking, our BGA SSD solutions ensure …
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BGA SSD - Exascend
BGA SSD product supports BGA 291 balls form factor, integrating high speed PCIe Gen 4 x 4 interface with third generation 3D TLC NAND flash memory technology, delivering capacities up to 1TB. BGA SSD products are offered in two product categories with different over-provisioning.
Industrial NVMe BGA SSD with Heatsink | M.2 Type 1620 - ATP …
These SSDs with high-speed PCIe 3.0 interface x4 lanes and NVMe protocol deliver up to 32 Gb/s bandwidth at 8 Gb/s per lane, while dimensions of just 16 (L) x 20 (W) x 1.6 (H) mm, the M.2 Type 1620 form factor, and 291-ball packaging take …
NVMe NANDrive® 嵌入式固态硬盘(SSD)产品系列将绿芯先进的PCIe控制器与一个或多个 NAND闪存芯片集成在一个小的球栅阵列(BGA)封装中。 该系列可提供基于SLC(每单元1bit)
BGA SSD : NVMe in a tiny package - atpinc.com
2021年5月3日 · With just 16 (L) x 20 (W) x 1.6 (H) mm, the 291-ball BGA SSD features PCIe 3.0 interface x4 lanes and NVMe protocol to deliver up to 32 Gb/s bandwidth at 8 Gb/s per lane
Exascend 至誉科技推出 AS500 系列 BGA SSD:最高读取速度 …
2024年5月18日 · 至誉 AS500 BGA 固态硬盘支持 PCIe 4.0 协议,采用大小为 16mm x 20mm 的 291 Ball BGA 封装,使用 3D TLC 闪存, 可选 128GB / 256GB / 512GB / 1TB 容量。 该硬盘无内置 DRAM 缓存,采用 HMB(Host Memory Buffer)方案,性能参数如下:
群联BGA SSD - yickic.cn
群联的 μssd(bga ssd)设计基于jedec标准以及最新的sata & pcie接口,用以简化客户pcb设计并提高板件等级可靠性。 sata高达512gb容量以及pcie高达1tb容量,不仅均支持全范围温度,更符合 iatf 16949标准并可自由选配jedec/jesd-22规格。
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