48x 12 36 48x l bottom view top view side view qfn48 7x7, 0.5p case 485aj−01 issue o date 27 apr 2007 0.15 c d a b e pin 1 location 0.08 c 0.05 c e 0.10 c 0.05 c a b c notes: 1. dimensions and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. ... 48x mechanical case outline package dimensions

Package Outline Drawing L48.7x7C 48 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (PUNCH QFN) Rev 0, 1/08 located within the zone indicated. The pin #1 identifier may be Unless otherwise specified, tolerance : Decimal ± 0.05, body Tiebar shown (if present) is a non-functional feature. The configuration of the pin #1 identifier is optional, but must be

48x 0.1 A B C +0.031) Soldering Type: Reflow Soldering Manufacturer Date code (YYWW) Lot code G = Green Product Type code XX 12345678 12345678 Pin 1 marking G 7.3 7. 3 1.3 1.2 12 0.3 1 6 Index Marking R elø 3 0m: 2.5 Pi c s/ Reels/Box: 1 x 2.500 = 2.500 Package outline 7 x 7 Solder resist covering vias and segmenting thermal pad (optional) 5.2 ...

Package Outline Drawing L48.6x6B 48 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 0, 9/09 TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" SIDE VIEW TOP VIEW ... ( 48X 0 . 20 ) ( 48X 0 . 65 ) ( 44 X 0 . 40 ) 0.05MC. Title: L48.6x6: 48 Lead Thin Quad Flat No-Lead Plastic Package Author: Renesas Subject:

48X PKG OUTLINE *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ ”, may or may not be present. Some products may not follow the Generic Marking. MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS

48X PKG OUTLINE *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ ”, may or may not be present. Some products may not follow the Generic Marking. MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS DOCUMENT NUMBER: 98AON39236E DESCRIPTION:

48X (0.3) 48X (1.5) (R0.05) TYP 4214859/B 11/2020 DGG0048A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for ...

All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. This drawing is subject to change without notice. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. 4.

Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Package Outline Drawing L48.5x6 48 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 0, 2/12 BOTTOM VIEW DETAIL "X" SIDE VIEW TYPICAL RECOMMENDED LAND PATTERN TOP VIEW located within the zone indicated. The pin #1 identifier may be Unless otherwise specified, tolerance : Decimal ± 0.05 Tiebar shown (if present) is a non-functional feature.