hc32l130f8ua-qfn32由xhsc(小华)设计生产，立创商城现货销售，正品保证，参考价格￥2.47，封装为qfn-32-ep(4x4)。 商城还提供HC32L130F8UA-QFN32专业中文资料、详细参数、引脚图、PCB焊盘图，典型应用图，Datasheet数据手册等资料查询和免费下载。

DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT.

QFN/DFN 為無引腳設計,一般很難從其外觀的焊錫點來判斷其焊錫性是否良好,目前 QFN/DFN 的焊錫檢查主要用電測 (In-Circuit-Test 、 Function Test) 來偵測其功能,一般也會佐以光學儀器或 X-ray 來檢查焊錫的開、短路不良現象。 功能測試正常, 以顯微鏡檢驗結果引腳側面未爬錫,以X-Ray檢驗結果引腳下方有錫。 QFN/DFN 封裝側面的引腳是 Leaf frame( 導線架)的切斷面,並無電鍍處理,所以很難吃錫, IPC-A-610 並未定義側面引腳要吃錫( 規範中Note 5 說明上圖H 的部位不需吃錫), …

QFN 4x4-16L Case Outline Notes (1) Use millimeters as the primary measurement. (2) Dimensioning and tolerances conform to ASME Y14.5M. - 1994. (3) N is the number of terminals. Nd and Ne is the number of terminals in each D and E site respectively. (4) Dimensions b applies to plated terminal and is measured between 0.15 mm and 0.30 mm from ...

24-Lead Plastic Quad Flat, No Lead Package (MJ) – 4x4x0.9 mm Body [QFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

24L_QFN_4x4mm_K6.fm Author: C12761 Created Date: 20020510114735Z ...

2024年11月22日 · QFN封装，即Quad Flat No-leads Package，是一种广泛应用在MCU芯片的四面无引脚平面封装。 因其体积小、散热性能好、信号传输损失低等优点，QFN封装受到广泛青睐。

AW20054QNR由AWINIC(艾为)设计生产，立创商城现货销售，正品保证，参考价格￥3.55，封装为QFN-32-EP(4x4)。商城还提供AW20054QNR专业中文资料、详细参数、引脚图、PCB焊盘图，典型应用图，Datasheet数据手册等资料查询和免费下载。

DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE.

a 4x4 mm QFN Prepared by: Roger Stout ON Semiconductor Overview The 4x4 QFN package is becoming popular for many signal and interface applications. To enable optimal thermal performance, this package has an exposed heatsink designed to be soldered directly to a metal pad on the application board. The purpose of this article is to show how ...