In this study, three-dimensional thermo-electrical finite element analysis is employed to characterize the current density and temperature distributions, current crowding effects as well as thermal gradients in micro-scale Sn3.5Ag solder joints with different sizes and geometries.

2022年11月1日 · This paper presents the effect of electromigration and isothermal ageing in lead-free SAC305 (Sn3Ag0.5Cu) solder joints of chip-size surface mounted (SMD) components, where different track-to-pad joining angles define the current density in the joint.

2023年6月1日 · In this study, thin-film-structured Ag and Sn3.5Ag samples were prepared to observe their reliability behaviors during electromigration (EM) tests at low and high current densities. Under a low current density (8.89 × 10 4 A/cm 2), the Ag stripe shows good resistance to EM, and microstructural changes are only observed in the Sn3.5Ag sample.

2022年7月4日 · This study considers the effect of the pad opening size and solder bump height on the EM lifetime of flip chip Cu/Sn-3.5Ag/Cu solder bumps. Additionally, to focus on EM behavior by excluding extrinsic factors such as Joule heating, EM tests were performed using a multi Sn96.5Ag3.0Cu0.5 (SAC305) solder line sample.

2007年10月10日 · The microstructural evolution, die shear strength, and electrical resistivity of Cu/Sn-3.5Ag (wt.%)/Cu ball grid array (BGA) solder joints were investigated after 1 to 10 reflows using scanning electron microscopy (SEM), transmission electron microscopy (TEM), electron probe microanalysis (EPMA), bonding testing, and a four-point probe station.

In this experiment, five different alloys are used and compared with the SAC305 alloy, two of which, Innolot and SAC-Bi, are bi-based solder alloys. This study includes three common SFs:...

In this study, a Cu-5wt.%Ag alloy fabricated using powder metallurgy (PM) and casting (CA) methods were processed by cold drawing. The effects of varying cold-drawing strains on the microstructure, mechanical properties, and electrical conductivity were …

Electromigration Behavior of Sn-3.5Ag Solder Joints with (110) and (111) Nanotwinned Cu UBMs Abstract: The effect of UBM type ((111) and (110) nt-Cu, polycrystalline Cu) on electromigration behavior of solder joints with different orientations $\beta-\mathbf{S n}$ grains was investigated.

在这项研究中，制备了薄膜结构的 Ag 和 Sn3.5Ag 样品，以观察它们在低电流密度和高电流密度下的电迁移 (EM) 测试期间的可靠性行为。 在低电流密度（8.89 × 10 4 A/cm 2）下，Ag 条纹显示出良好的抗电磁性，并且仅在 Sn3.5Ag 样品中观察到微观结构变化。

摘要: 以钛粉和银粉为原料,不同含量的碳酸氢铵为占位剂,采用粉末冶金的方法制备多孔Ti-5Ag合金。结果表明制备的多孔Ti-5Ag合金的相组成为α-Ti。随着碳酸氢铵添加量的增加,多孔Ti-5Ag合金的密度逐渐降低,孔隙率逐渐增加。