2017年5月5日 · The second-generation 7 nm from TSMC (CLN7FF+) will use EUV for select layers and will require developers to redesign EUV layers according to more aggressive rules.

TSMC's N7+ Technology is First EUV Process Delivering Customer Products to Market in High Volume. The N7+ process with EUV technology is built on TSMC's successful 7nm node and paves the way for 6nm and more advanced technologies.

2018年1月18日 · HALF MOON BAY, Calif. — Extreme ultraviolet lithography (EUV) is set to enable 10-nm and 7-nm process nodes over the next few years, but significant work is still …

2018年10月18日 · Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has completed all process technology development and has started wafer production of its revolutionary process node, 7LPP, the 7-nanometer (nm) LPP (Low Power Plus) with extreme ultraviolet (EUV) lithography technology.

In 2018, TSMC led the foundry to start 7nm FinFET (N7) volume production. N7 technology is one of TSMC’s fastest technologies in terms of time to volume production and provides optimized manufacturing processes for both mobile computing applications and high-performance computing (HPC) components.

Compared to its 10nm FinFET predecessors, Samsung’s 7LPP technology not only greatly reduces the process complexity with fewer layers and better yields, but also delivers up to a 40% increase in area efficiency with 20% higher performance or up to 50% lower power consumption.

2018年10月9日 · TSMC initiated high-volume manufacturing of chips using its first generation 7 nm fabrication process (CLN7FF, N7) in April. N7 is based around deep ultraviolet (DUV) lithography with ArF...

The N7+ process with EUV technology is built on TSMC’s successful 7nm node and paves the way for 6nm and more advanced technologies. The N7+ volume production is one of the fastest on record.

2019年10月8日 · In a statement published yesterday, TSMC has confirmed that it has achieved High Volume Manufacturing (HVM) on its critical 7nm+ Extreme Ultra Violet (EUV) process. This is a landmark event...

EUV is a new extendable litho-technology allowing customers to continue cost effective shrink and up to 5-10x simpler and faster manufacturing cycles for at least the next 10 years