Part #: 8SOIC. Download. File Size: 295Kbytes. Page: 1 Pages. Description: 8 PIN SOIC PACKAGE OUTLINE. Manufacturer: SMSC Corporation.

2020年6月24日 · 芯片封装是集成电路与外部电路连接的物理接口，不同的封装形式适用于不同的应用场景。底部焊球阵列封装，焊球间距通常为1.0mm、0.8mm或0.5mm。SOP的缩小版，引脚间距更小（通常为0.65mm或0.5mm）。底部焊盘阵列封装，焊盘间距通常为1.0mm或0.8mm。引脚间距通常为0.8mm、0.65mm或0.5mm。

8SOIC 8 PIN SOIC Package Outline . Remarks Overall Package Height Standoff Package Body Thickness X Body Size Lead Span Y Body Size Lead Foot Length Lead Length Lead Width Lead Thickness Lead Pitch Coplanarity. 1. All dimensions are in millimeters. 2. True position

8 PIN SOIC/SOIN PACKAGE OUTLINENotes:1. All dimensions are in millimeters.2. True position spread tolerance of each lead is ±0.125mm at maximum material condition.3. Dimension "D" does not include mold flash, protrusions or gate burrs. Maximum mold flash, protrusions or gateburrs is 0.15mm per end. Dimension "E1" does not include inter …

www.vishay.com 2 Document Number 83247 Rev. 1.2, 07-Apr-04 VISHAY SOIC-8 Vishay Semiconductors Ozone Depleting Substances Policy Statement It is the policy of Vishay Semiconductor GmbH to 1.

8-Pin Plastic Small Outline Surface Mount, 8-SOIC Datasheet, 8-SOIC circuit, 8-SOIC data sheet : BOURNS, alldatasheet, Datasheet, Datasheet search site for Electronic Components and Semiconductors, integrated circuits, diodes, triacs and other semiconductors.

View 8-SOIC Pkg Spec by Altera datasheet for technical specifications, dimensions and more at DigiKey.

2022年4月29日 · 1.简要信息如下： 2. SOP和SOIC的规格多是类似的，现在大多数厂商基本都采用的是SOIC的描述： SOIC8有窄体150mil的（外形封装宽度，不含管脚，下同), 管脚间距是1.27mm，如下： 有宽体的208mil的，管脚间距是1.27mm，如下： 上面两种规格主要是针对8P的，常用的14P和16P主要是150mil规格的窄体，管脚间距是1 ...

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8SOIC PDF技术资料下载 8SOIC 供应信息 8 PIN SOIC/SOIN PACKAGE OUTLINE 3 D e 8 H SEE DETAIL "A" 0.25 3 E1 E GAUGE PLANE L 5 INDEX AREA (D/2 X E1/2) 1 2 8X b 2 4 4 c L1 0°-8° TOP VIEW END VIEW DETAIL "A" (SCALE: 3/1) C A2 A SEATING PLANE A1 ccc C SIDE VIEW 3-D VIEW Min A A1 A2 D E E1 L L1 b c e ccc Notes: 0.31 0.17 1.35 0.10 1.25 4.80 5.80 3.80 0.40 Nominal 4.90 6.00 3.90 1.05 REF ...