Socket AM4 is a PGA microprocessor socket used by AMD 's central processing units (CPUs) built on the Zen (including Zen+, Zen 2 and Zen 3) and Excavator microarchitectures. [1][2] …

Zen 4 is the name for a CPU microarchitecture designed by AMD, released on September 27, 2022. [4][5][6] It is the successor to Zen 3 and uses TSMC 's N6 process for I/O dies, N5 …

Zen is a family of computer processor microarchitectures from AMD, first launched in February 2017 with the first generation of its Ryzen CPUs. It is used in Ryzen (desktop and mobile), …

The chiplet architecture enables leading edge 7nm [1] CPUs for multiple markets, while retaining backward compatibility to complex IO and memory subsystems in a scalable design with high …

X570 的南桥是 14nm 的 IO die，所以发热是十分巨大的，南桥一般都会配备一个风扇 (除了 ROG C8DH)。 X570 可以提供最多 16 条 PCIE4.0 (八条和 SATA 公用)、12 个 SATA (八个和 …

2023年3月5日 · Although we've known most of the details of AMD's I/O die in its Zen 4 processors, until now, AMD hadn't shared a die shot of the cIOD, but thanks to its ISSCC 2023 …

• INNOVATIVE FUTURE: The hybrid multi-die architecture puts us on a path of rapid innovation Our 3D V-Cache technology adds cache memory to CPU dies today, but we don’t see …

2024年8月14日 · Am4 是 2016 年发布的 AMD 芯片组，取代了 Am3+。 它支持 AMD 的 Ryzen 插槽，并得到了主板制造商的广泛采用，使其成为市场上最受欢迎的 AMD 芯片组。 AMD 专门 …

2023年6月6日 · We take a deep dive into the microarchitecture used in the latest AMD Ryzen 7000 CPU lineup, from cache changes to the new front end and AM5 socket. The latest AMD …

"T-Topology" memory trace layout does great with 4 DIMMs but is less effective with 2 DIMMs, and makes this board weak at ram relative to more recent boards. Notable Features: Full …