Amkor offers a broad line of TQFP (Thin Quad Flat Pack) IC packages. These packages allow IC packaging engineers, component specifiers and systems designers to solve issues such as increasing board density, die shrink programs, thin end‑product profile and portability.

Two of Amkor’s most popular traditional leadframe package types are Small Outline Integrated Circuit (SOIC) and Quad Flat Pack (QFP), also commonly known as “Dual” and “Quad” products. Learn More about Leadframe

Amkor offers a broad line of TQFP (Thin Quad Flat Pack) IC packages. Amkor’s TQFPs are an ideal package for most IC semiconductor technologies such as ASIC, gate arrays (FPGA/PLD), microcontrollers and PMIC controllers.

Amkor’s ExposedPad LQFP/TQFP family of power IC packages significantly increases the thermal efficiency of power-constrained standard LQFP and TQFP packages. These packages can increase heat dissipation by as much as 110% over standard LQFP/TQFP packages, thereby expanding the margin of operating parameters.

Amkor offers a broad line of LQFP (Low-profile Quad Flat Package) IC packages designed to provide the same great benefits as TQFP packaging with a 1.4 mm body thickness. These packages allow IC packaging engineers, component specifiers and systems designers to solve issues such as increasing board density, die shrink programs and thin end ...

Amkor’s TQFPs are an ideal package for most IC semiconductor technologies such as ASIC, gate arrays (FPGA/PLD), microcontrollers and PMIC controllers. TQFP packages are particularly well suited for electronic systems applications requiring broad performance characteristics, including computing, video/ audio, telecommunications, data

Amkor’s LQFPs are an ideal package for most IC semiconductor technologies such as ASIC, PMU controllers, microprocessors, gate arrays (FPGA/PLD) and PC chip sets. LQFP packages are particularly well suited for electronic systems requiring broad performance characteristics.

2016年7月11日 · Amkor의 QFP package들은 다양한 크기와 두께를 제공하고 있어, designer 혹은 system engineer들에게 application 요구사항에 따라 IC package의 사이즈를 유연성 있게 적용하도록 하고 있습니다. Amkor Korea에서는 LQFP (1.4mm thickness) / TQFP (1.0mm thickness)를 양산하며, 그 밖의 QFP package들은 국외 공장을 통해 제공합니다. Reference. Cross Section – Normal Type. 앰코코리아 홈페이지에서 자세한 정보 보기. WRITTEN BY 미스터반. …

Amkor’s LQFPs are an ideal IC package for most IC semiconductor technologies such as ASIC, DSP, controllers, processors, gate arrays (FPGA/PLD), SRAMs and PC chip sets.