2019年1月24日 · Formulated to work with any alloy and heating process, Nordson EFD’s FluxPlus™ is perfect for BGA rework, mobile device repair, reflowing solder paste, and more. Unlike liquid fluxes, tacky FluxPlus can be applied exactly where needed without contaminating nearby areas. EFD provides a wide array of formulations for use in a variety of applications.

Interflux ® IF 8300 is a no-clean, halide-free tacky gel flux suitable for reballing and BGA rework. Stencil printing is the most used method to apply solder paste on the pads of a PCB (Printed Circuit Board) in the SMT (Surface Mount Technology) assembly line in …

Scope of application: suitable for soldering Iron Tip Cleaning,mobile phone, BGA repair, PC card and other precision electronic chip-level flux soldering. Have strong oxide removal effect to gold-copper alloy substrate and Wire.

Superior Flux offers a range of versatile tacky flux, including No-Clean, water-soluble and rosin (Type RMA). Our tacky fluxes can be manually applied via syringe, automatically dispensed or stencil printed.

This No-Clean flux is engineered to be used in the placement and reflow of leadfree solders for - BGA attach processes. Before reflow, the flux provides sufficient tack to hold the BGA in place.

This Water Soluble flux is engineered to be used in the rework and repair associated with BGA components. Before reflow, the flux provides sufficient tack to hold the BGA in place.

ALPHA OM-338-PT BGA Flux NO-CLEAN LEAD-FREE BGA FLUX This NO-CLEAN flux is engineered to be used in the placement and reflow of lead-free solders for BGA attach processes. Before reflow, the flux provides sufficient tack to hold …

ALPHA Paste Flux is the leading choice of solder flux for wafer level CSP, Flip chip and BGA/ CSP ball attach applications. Excellent activity allows for excellent soldering to ENIG and Cu OSP soldering process. Superior wetting maximizing assembly yields to provide highest ball attach and flip chip yield rates.

NC-559-ASM BGA Flux Solder Paste Flux 100g Flux. No-clean solder paste. Less residue, welding light, less smoke, no irritating odor. High viscosity no-clean fluxes can be used for rework, ball or lead attachment to BGA, CGA and CSP packages and assembly operations.