Beckett Card Grading Service - The most accurate and trusted grading in the collectibles industry for sports cards, gaming cards and non-sports cards. Turn your raw cards into graded assets...

Cross-cut section of BGA mounted circuit A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins that can be put on a dual in-line or flat package.

Beckett Graded Card Lookup helps potential buyers of your BGS graded card (s) look up the important grading information they need before purchasing.

Know about the Card Grading Service Levels, Pricing and Turnaround Times offered by Beckett. No Membership, No Upcharges & Half-point Grading make us the best.

Today we’re diving deep into the world of Beckett Grading Services (BGS). If you’re looking to enhance the value and prestige of your cherished collectibles, understanding the ins and outs …

2022年2月8日 · Cards graded a BGS 9.5 (Gem Mint) or BGS 10 (Pristine) have a gold-colored label. Silver labels are affixed to cards graded either BGS 8.5 or BGS 9, whereas the remainder of BGS-graded cards have a white label.

2024年3月18日 · BGS card grading is a meticulous process that involves evaluating the condition and authenticity of trading cards. The primary goal of BGS grading is to provide collectors and enthusiasts with an accurate and standardized assessment of a card's quality, which in turn significantly impacts its market value.

2024年12月24日 · PSA and BGS are two sports and trading card grading companies that use a standard 1-10 scale. In addition, BGS also uses the 9.5 half point. PSA avoids this. PSA grading fees quickly exceed BGS grading fees. Both models increase in price with tier, but PSA has more premium-priced tiers.

Here is the basic criteria for each grade and area. Centering: 50/50 all around on front. 60/40 or better on back. Corners: Perfect to the naked eye and Mint under magnification. Edges: Perfect...

2025年2月11日 · Ball Grid Array or BGA is a surface-mount package (SMD Component) with no leads. This type of surface-mount packaging is used in Surface Mount Technology (SMT) and utilizes an array of metal spheres called solder balls for electrical interconnection. Solder balls are attached to a laminated substrate at the bottom of the package.