This procedure is used to remove BGA devices that have been underfilled with non-reworkable epoxy underfill. Minimum Skill Level - Expert Recommended for technicians with advanced soldering and component rework skills and extensive experience in …

This instructable shows how to do a DIY rework of BGA components, using a hothair gun and commonly available tools. Sometimes, expecially if they develop high temperatures during normal operations, the tin solder connecting their pins with board pads tend to become unreliable.

Here are the four essential steps of BGA repair. First, remove the components, such as the PCB. Preheat the PCB until the solder becomes molten, and then remove the PCB with a vacuum. Be careful of damage to the BGA pads when you remove the BGA itself.

2025年1月24日 · On the BGA rework station, secure a board and calibrate optics. Step 2: BGA Removal. You can heat the BGA and remove it by applying the flux. To remove the BGA, do the following: Place a preheating nozzle under the board, centered below the BGA. To gently warm the board, set the preheater to 150°C and heat it for one to two minutes.

Proper BGA rework technique is essential to safely remove and replace BGAs without damage. This guide covers BGA rework fundamentals, the necessary tools, and step-by-step process instructions. BGA packages connect the IC to a PCB through an array of solder balls on the bottom of the package:

Remove the component using the vacuum tool. Note: If software controls the vacuum, select the vacuum on command for all events. This will lift the component as soon as reflow temperatures have been reached. If the component can not be removed, analyze the temperature data and adjust the parameters. Return to step 10.

Removing a BGA chip is a technical and challenging task that requires precision, the right tools, and a careful approach. By following the steps outlined in this guide, you can successfully remove a BGA chip without damaging your PCB or components.

Remove the unwanted solder balls using a dynamic solder wave. Run the components through a filtered hot water rinse to remove the flux residues. Dry the components using an air knife.

2019年5月15日 · bga芯片拆卸方法. 1）记位：由于bga器件不像qfp/sop封装器件那样引脚外露，为了避免拆取后装回定位不准，一般须在拆取前对ic位置作标记。 通常bga器件都在其定位区有标志线印制在pcb上，形状如直角标或短虚线。如果没有此类标志，可在ic四面沿ic边角贴上胶纸 ...

2012年10月17日 · Copper areas under the BGA (such as powerplanes) act as heatsinks. Without bottom heating, it is practically impossible to remove the BGA without damaging the part and the PCB as well. Do you need to salvage the chip, the board or both?