We have over 200 people working in more than 30 markets across the Indo-Pacific and covering this dynamic region with detail, nuance and expertise that is unmatched. At BGA, we put people first in all that we do.

At BGA, We Know Asia. BGA applies unmatched expertise and experience to help clients navigate the world’s most complex and dynamic markets. BGA’s ginkgo leaf logo conveys resilience and endurance, as it does in parts of Asia for its status as the oldest known surviving tree species thriving even under the harshest of conditions.

2023年12月11日 · The BGA Taiwan Team, led by Senior Adviser Rupert Hammond-Chambers, wrote an update to clients on Taiwan’s new critical technologies list. Context Taiwan’s National Science and Technology Council (NSTC) on December 5 announced its inaugural list of national core key technologies ( 國家核心關鍵技術 ), marking a significant ...

bga，又稱球柵陣列封裝技術，是一種高密度表面黏著封裝技術。在封裝底部，引腳呈球形並以網格狀排列，因此得名 bga。 bga封裝有哪些優點？它與其他包裝方式有何不同？ 1. 引腳佈局和密度. 傳統的引腳封裝（如 dip、sop等）通常將晶片引腳排列在封裝的兩側或 ...

2000年10月31日 · BGA其實是一種廣義的通稱，若是以載板所使用的材料區分，可以分為CBGA (Ceramic BGA)、PBGA (Plastic BGA)、TBGA (Tape BGA)等。 台灣生產PBGA載板的公司有全懋、耀文、群策、日月宏等公司，生產TBGA載板的公司則有楠梓電子。 如果BGA載板是以Polyimide膠帶替代一般BGA所使用的玻璃環氧樹脂，則稱之為Tape...

Wire Bond BGA Overview With new generation of memory devices, low profile, less power consumption, high density, and time to market, PTI’s solution can reach all these requirements and even better.

郭育仁會長2023年6月2日至6月4日拜訪日本智庫 BGA (Bower Group Asia)，與日本眾議員、前自民黨幹事長甘利明，BGA常務取締役 (Managing Director) 油木清明，笹川和平財團 日米台安全保障研究委員西山淳一，就台日經貿合作之願景，互相交換意見。

2023年2月21日 · BGA（Ball Grid Array）封裝，即球栅陣列封裝，它是在封裝體基板的底部製作陣列焊球作為電路的I/O端與印刷線路板（PCB）互接。 採用該項科技封裝的器件是一種表面貼裝型器件。

2024年10月30日 · Taiwan’s 2025 defense budget of NT$647 billion ($20.2 billion) represents a historic financial high, increasing by approximately NT$40 billion ($1.3 billion) from the previous year. This increase primarily reflects the peak payment period for several major military projects, concentrated between 2025 and 2027.

The Multi-Package BGA has proven to be the most effective packaging, which integrates currently available ICs into a smaller, more cost-effective, single package. Specific examples of Multi-Package BGA applications include core logic chip sets, microprocessor, micro controller systems, and graphics cards.