2025年3月13日 · BE Semiconductor Industries N.V. (Besi) develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, cloud server, computing, automotive, industrial, LED and solar energy.

2022年10月20日 · Original file ‎ (SVG file, nominally 150 × 118 pixels, file size: 68 KB) Deutsch: Logo von BE Semiconductor (kurz Besi). This logo image consists only of simple geometric shapes or text. It does not meet the threshold of originality needed for copyright protection, and is therefore in the public domain.

Besi Netherlands, based in Duiven, the Netherlands, designs, develops and manages the production of molding, trim & form and singulation systems for both leadframe, substrate and wafer level packaging applications under the Fico brand name.

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Besi is a publicly traded company, and its shares are listed on the Euronext Amsterdam stock market under the BESI ticker symbol. [4][5] In 2021, Besi was valued at around $5.6 billion. [5] Besi offers die attach, packaging and plating solutions, with the die attach segment making up 82 % of the revenue in 2021. [6] .

Besi 为广泛的终端用户市场（包括电子、移动互联网、计算、汽车、工业、LED 和太阳能）开发用于引线框架、基板和晶圆级封装应用的领先组装工艺和设备。

Besi Logo.jpg. Format JPEG. Source BE Semiconductor Industries N.V.

Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of ownership.

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