BE Semiconductor Industries N.V. (Besi) develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, cloud server, computing, automotive, industrial, LED and solar energy.

Besi’s die attach equipment is based on unique and innovative concepts offering economical benefits to customers. The Esec 2100 hS ix is the latest member of the 2100 i Die Bonder family. It is optimized for highest speed and scratch-free transport thanks to the easy-to-use motorized and programmable rail strip handler.

Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of ownership.

Besi Machining is a provider of machined components and assemblies to industries including industrial, manufacturing, and automation. Currently established in a 10,000 sq. ft. facility located in Youngsville, North Carolina, Besi Machining is prepared to utilize our industry expertise to help you with product design and production challenges.

BE Semiconductor Industries N.V., simply called Besi, is a Dutch multinational company that designs and manufactures semiconductor equipment. [1][2] Besi offers die attach, packaging, and plating solutions. The company was founded in May, 1995 by Richard Blickman, who still leads the company today.

It is specialized in the production and operation tunnel waterproof material construction series of special equipment (high-frequency hot-melt welding machine (magnetic welding machine), adjustable geomembrane welding machine (creeping welding machine), new generation ultrasonic spot welding machine, hot wind welding gun, latest water stop belt ...

The BESI Datacon 8800 is a high-performance die bonding machine specifically designed for semiconductor packaging, LED packaging, and precision electronics manufacturing. With its advanced technology, the Datacon 8800 delivers fast and precise die attach processes for various chip and substrate types, making it ideal for use in electronics ...

2024年9月5日 · BESI’s current outlook and strategy, and a detailed analysis of the company’s financials and valuation, with thoughts on whether it makes sense to invest here.

The manual machine is especially developed for offline cleaning and molding process parameter optimization. By making use of the original molds, new products can be developed and optimized prior to large scale production.

Besi Austria’s area of expertise is the development of leading-edge high-precision and high-flexibility assembly and die-handling equipment for flip-chip and multi-chip substrate and wafer-level packaging applications in a wide range of end-user markets including electronics, mobile internet, cloud server, computing, automotive, industrial ...