CMP Defect Reduction and Mitigation: Practices and Future Trends
Besides the selection and optimization of cleaning chemical and post cleaning process itself, overall CMP defect reduction and mitigation must take into account the events and …
Potential causes of CMP defects and possible solutions [33].
Therefore, understanding and developing silica nanoparticles are crucial for achieving CMP performance, such as removal rates, selectivity, decreasing defects, and high uniformity and …
CMP Defects; Their Detection and Analysis on Root Causes
2012年3月16日 · Particles and scratches are most wanted defects to be minimized in CMP processes. The root causes for them are mostly consumables related such as pad, slurry and …
Approaches to defect characterization, mitigation and reduction
2022年1月1日 · The presence of any post-CMP defects of equal or greater size on the Cu surface poses serious concern for yield loss. As a consequence, the characterization, mitigation, and …
Reduction of CMP-induced wafer defects through in-situ removal …
This paper will present data that show the impact of PSM on CMP-induced wafer defects. CMP-induced scratches are typically caused by particles, such as agglomerated abrasive, pad …
Fast and accurate defect classification for CMP process monitoring
In this paper, an automated defect classification algorithm, inLine Defect Organizer (iDO™), is used in conjunction with laser scattering inspection technology to classify scratch, ring pit and …
Defects formation on wafers after chemical mechanical polishing (CMP) is a critical issue in semiconductor industries as it reduces chip yield and reliability [1]. The commonly...
•As device geometries shrink, CMP slurry, handling & delivery play an important role in modulating defects •Slurry parameters present an important opportunity in defect reduction 10
CMP缺陷减少和缓解:实践和未来趋势 - Book学术
2021年5月10日 · 衬垫表面孔隙几何形状可以影响抛光过程中碎屑的传输，从而调节抛光残留物 (PR)、异物 (FM)和划痕等缺陷的产生。 护发素和调理过程也起作用。 除了选择和优化清洗化 …
Defects Observed on the Wafer after the CMP Process
2007年3月23日 · Summary This chapter contains sections titled: Introduction Defects After Oxide CMP Defects After Polysilicon CMP Defects After Tungsten CMP Defects After Copper CMP …