
cmp抛光头(head) - 知乎专栏
2023年11月27日 · Cmp工艺中常用的 Preston方程 为: MRR=kPv. 其中: MRR 是材料去除率. k是一个经验常数,取决于抛光垫的材料、抛光液的化学性质、晶圆材料等。 P 是抛光头施加的下压力. v 是抛光头或晶圆表面相对抛光垫的速度
CMP head structure with retaining ring - Google Patents
the CMP structure comprises a polishing pad on a platen table; a head assembly for holding a wafer against the polishing pad, wherein the head assembly includes the retaining ring; a sensor for sensing the depth of grooves on the retaining ring and a controller for determining an update pressure to apply to the retaining ring based on the depth ...
KR20100095325A - 웨이퍼 평탄화 구조를 갖는 화학적기계적연마 …
본 발명은 반도체 제조 공정의 CMP(Chemical Mechanical Polishing) 장치에 있어서 웨이퍼를 평탄화하기 위하여 사용되어지는 CMP Head 의 구조에 대한 것으로, CMP 공정상에서 웨이퍼를 평탄화하기 위해 웨이퍼 전체에 일정한 압력을 가하며 회전하는 구조에 있어서 보다 ...
Polishing Head - an overview | ScienceDirect Topics
Hence a polishing head that holds a wafer and applies pressure is considered as a central part of CMP processing. The polishing head consists of the following three parts: 1. A part that applies uniform pressure to the back of the wafer. 2. A retainer ring that prevents detachment of the wafer. 3. A chuck that holds the wafer while it is carried.
Turnkey CMP Head Rebuild & Refurbishment - SemiGroup
With our Turnkey CMP Head Rebuilding Service, you gain immediate access to fully refurbished CMP heads, eliminating downtime and enabling uninterrupted production. No waiting weeks for parts or rebuilds—our inventory is stocked and ready to go.
CMP Head – Power Team Technologies (S) Pte Ltd
Their offerings encompass from polishing slurries and polishing pads to ultra-precise components for CMP polishing heads (including retaining rings and adsorption films), as well as assembly services.
【科普】一文带你了解CMP设备和材料 - 知乎 - 知乎专栏
CMP 设备主要依托 CMP 技术的化学-机械动态耦合作用原理,通过化学腐蚀与机械研磨的协同配合作用,实现晶圆表面多余材料的高效去除与全局纳米级平坦化(全局平整落差5nm以内的超高平整度)。
產品資訊 - 半導體關鍵零組件 - 瑞耘科技股份有限公司
cmp 化學機械研磨(Chemical Mechanical Polishing,CMP)是半導體製程上主要的全面性平坦化技術。 我們CMP晶圓夾持環(CMP Retainer Ring)產品是安裝於晶圓研磨機之研磨頭上,作用在晶圓研磨時能夾持住晶圓而不讓晶圓偏離研磨頭而造成破片,同時將研磨液能順利導入研磨頭作 ...
CMP Products – TWI
Designed to be used as backing film on a CMP polishing head, the WestFilm product line provides an effective buffer, preventing the wafer from being scraped or shifting during polishing. It uses superior technology that offers customers customized, improved precision and alignment at more competitive pricing.
CMP Head Repair - Service & Parts - SemiGroup
Our experienced CMP head repair technicians can refurbish, convert and upgrade your CMP heads to equivalent or better than original OEM quality standards.