2023年12月15日 · We used DC magnetron sputtering to deposit niobium nitride (NbN) on the copper foam (Cu foam) substrate to fabricate NbN@Cu foam. The fabricated NbN@Cu foam electrodes demonstrate a highly porous structure with …

2018年4月25日 · Owing to the unique yucca fern shaped CuO cluster and a synergistic effect with the 3D conductive network, this CuO NWs@Cu foam composite demonstrates a better electrochemical performance...

In this review, combining with the advantages of a three-dimensional network structure of metal foams, we summarize recent progress on Cu foam (CF)-derived materials as efficient...

The CuO NWs@Cu foam electrode displayed good cyclic stability and a dis- charge capacity of 461.5 mAh/g even at the 100th cycle. In contrast, the CuO NWs@Cu foil electrode gave similar...

2020年12月20日 · Cyclic voltammetric (CV) responses were obtained at 100 mV s − 1 for Cu foam containing ~1.5 wt.% Ni and for a pure Cu foil (99.96%) to show the presence of Ni in the Cu foam. All electrochemical impedance spectroscopic (EIS) measurements were taken at potentials that are 50 mV anodic to the OER onset potential with a sinusoidal AC potential ...

2020年11月27日 · The test of cyclic voltammetry (CV), electrochemical impedance spectroscopy (EIS), and galvanostatic charge–discharge (GCD) were used to investigate the electrical performance of the CuO/Cu foam electrodes.

2020年5月8日 · In this paper, we demonstrated synthesis of nanostructured CuO on conductive Cu foam by chemical precipitation deposition method using surfactant approach. Two different nanostructure of CuO such as cuboids and nanoflower formed on Cu foam. Formation of monoclinic CuO is confirmed from XRD and FTIR.

The cyclic voltammetry, galvanostatic charge discharge as well as electrochemical impedance spectroscopic results are justifying the potential candidature of CuO/Cu(OH)2 nanostructures on copper...

2020年3月1日 · Flexible self-assembled 3D hollow tubular Cu 2S nanorods is in-situ grown on the Cu foam substrate (Cu 2 S@Cu). The Cu substrate is simultaneously acted as a copper source and a collector, which reduces the contact resistance.

2016年12月6日 · A robust, millimeter-sized low-density Cu foam with ∼90% (v/v) porosity, ∼30 nm thick walls, and ∼1 μm diameter spherical pores is prepared by the slip-casting of metal-coated polymer core–shell particles followed by a thermal removal of the polymer. In this paper, we report our key findings that enable the development of the low-density Cu foams.