Monolithic three-dimensional integration of RRAM-based hybrid …
2023年11月6日 · In this work, we report the monolithic three-dimensional integration (M3D) of hybrid memory architecture based on resistive random-access memory (RRAM), named M3D …
Monolithic 3D integration of 2D materials-based electronics
2023年11月27日 · We envision that the proposed M3D integration strategy, based on 2D materials, will bring considerable innovation in integrated chip applications and lead to the next …
A review on monolithic 3D integration: From bulk semiconductors …
Monolithic three-dimensional (M3D) integration represents a transformative approach in semiconductor technology, enabling the vertical integration of diverse functionalities within a …
Monolithic 3D integration as a pathway to energy-efficient …
2024年12月1日 · By vertical stacking of multiple functional layers, such as memory, logic, and sensor, on a single chip, M3D could enhance the chip functionality, integration density and …
Growth-based monolithic 3D integration of single-crystal 2D ...
2024年12月18日 · Here we present a method for growing single-crystalline channel materials, specifically composed of transition metal dichalcogenides, on amorphous and polycrystalline …
Heterogeneous integration toward monolithic 3D chip
Monolithic 3D (M3D) integration has attracted lots of attentions to continue equivalent scaling by vertically stacking transistors [1]. It allows the reduction of the interconnect delay, resulting in …
Network-on-Chip Design Guidelines for Monolithic 3-D Integration
2019年8月27日 · With M3D integration, network-on-chip (NoC) communication fabric can benefit from reduced link distances and improved intra-router efficiency. However, the sequential …
Emerging monolithic 3D integration: Opportunities and challenges …
2022年7月1日 · M3D integration can provide massive amounts of non-volatile memories such as RRAM, STT-MRAM to store the whole big-data workload on chip. The high-density MIVs can …
Advances in Design and Test of Monolithic 3-D ICs
2020年4月20日 · Monolithic 3-D (M3D) technology enables unprecedented degrees of integration on a single chip. The miniscule monolithic intertier vias (MIVs) in M3D are the key behind …
With M3D integration, network-on-chip (NoC) communication fabric can benefit from reduced link distances and improved intra-router efficiency. However, the sequential fabrication methods …