
Tape & Reel Packaging Solutions - Semiconductor | 3M US
Our latest semiconductor chip transport solutions start with carrier tapes to help prevent chip migration in thin package applications. They also include exciting capabilities for pre-barcoding that can help customers save time and improve crucial data analysis.
贴片类元器件IC芯片的包装方式在SMT贴片中应该如何选择? - 知乎
在芯片规格书里一般是Reel表示,表示编带,俗称卷盘包装,这是在SMT里最最普遍的包装方式,因为SMT采用的是自动化设备,要上机器料架达到自动贴片目的,卷带是最常用的规格。
關於樺塑 - hwashu.com.tw
樺塑已成為台灣唯一能提供IC Tray、 Tape & Reel及Chip Tray等IC承載包裝完整產品線之製造公司。
电子元器件的包装方式_tape reel-CSDN博客
2019年5月1日 · 一般分为四种:Tape Reel 就是卷装料。 一般用于SMD制程,可大量、快速的打件。 一般贴片的电阻、电容、二极管、三极管、晶振、小的IC等都可以用Tape Reel 包装。 Bulk 就是散装。 一般都是少量、样品用。 Tube 就是管装料。 因Reel一卷都是数千pcs不等。
Analog Devices’ tape and reel system is fully compat-ible with the detaping equipment that is standard in most automated placement equipment. In the tape and reel format, the components are placed in specifically designed pockets embossed in a plastic carrier tape.
精密载带与盖带 - 半导体元器件包装与转运 | 3M官方网站 | 3M 中国
Chiplet 集成使用再分布层(RDL)、硅中间层和与先进封装相关的基板,以及2.5D/3D、扇出和高密度倒装芯片设计等集成平台进行新型构造。 这也为芯片的成功运输带来了更大的挑战。 所以,我们的解决方案是什么? 微型组件封装带来了挑战,包括在载盖带封合过程中出现芯片吸附和芯片滑动的问题,因此元器件需要被具有精确成型的坚固的载带包装。 3M公司提供公差低至0.02mm的载带,D1孔尺寸低至0.01mm。 底部表面平整,拔模角度小。 我们的载带允许将口 …
TI ships product in three basic configurations: stick magazine, tray, and tape and reel. The following paragraphs define each packing configuration. Stick magazine − The stick magazine (also called shipping tube) was developed in the early days of the integrated circuit (IC) industry.
樺塑企業 – IC Tray, Tape & Reel 的領導廠商
Chip Tray 我們擁有超過1800套Chip Tray模具, 包括一般汎用Chip Tray及專屬承載LCD driver之COG Tray Read more
As a valued-added service, Actel offers tape-and-reel capabilities for several types of packages. With these options, customers can use tape and reel when operating pick-and-place equipment for volume production. Tape and reel offered by Actel is fully compliant to EIA-481 (Electronic Industries Association) standard.
Tape and Reel was promoted in the 1990s by Japanese manufacturers to improve automation of the steps for IC unpacking and subsequent mounting. Machines are used by NXP to pick ICs from trays and place them in the pockets of a specific carrier tape, which are then closed with a thin plastic seal tape.