2022年1月8日 · In this paper, a 2D CMUT array based on silicon material was successfully fabricated following a silicon wafer bonding process. The CMUT working frequency is 3.8 MHz and the 6 dB bandwidth is 110%, which make it suitable for underwater ultrasonic imaging.

2017年5月5日 · The introduction of wafer-bonding technique to capacitive micromachined ultrasonic transducer (CMUT) fabrication offered advantages over the surface micromachining technique, such as simplified fabrication, better membrane uniformity, and increased active area.

2021年5月4日 · The CMUT device is fabricated using silicon fusion wafer-bonding technology. A 5-?m thick Parylene-C is conformally deposited on the device for immersion measurement. The results show that the fabricated CMUT can transmit an ultrasound wave, receive an ultrasound wave, and have pulse-echo measurement capability.

The paper presents a wafer-level fabrication of a capacitive micromachined ultrasonic transducer (cMUT) using a wafer bonding process and interconnection techni

Abstract: This paper presents the fabrication process and electrical characterization of Capacitive Micromachined Ultrasonic Transducers (CMUTs) realized by fusion bonding. The transducer array with electrical connections was realized by four photolithography steps. The electrical characterization of two different geometries is presented.

2016年9月1日 · This study shows that through-wafer trench-isolation with a supporting frame is a viable solution for providing electrical interconnects to CMUT elements and that 2-D arrays fabricated using wafer-bonding deliver good performance.

2010年11月14日 · We present the successful fabrication of capacitive micromachined ultrasonic transducers (CMUTs) based on low temperature wafer bonding (<;400°C). Such a fabrication process enables the direct...

A surface roughness of 0.47 nm is measured for the PSOI device layer, and successful fusion bonds (direct bonds) are demonstrated between PSOI wafers and oxidized silicon wafers. A wafer-bonded CMUT using a PSOI wafer is fabricated and electrically characterized, and the expected CMUT performance is observed.

Fig. 2 shows the process used for fabricating the CMUT arrays based on a wafer bonding technique. First, the highly conductive Si wafers (0.01-0.025 ohm-cm) are selected. Then 400-and...

2024年12月1日 · Fabrication of 2D capacitive micromachined ultrasonic transducer (CMUT) arrays on insulating substrates with through-wafer interconnects using sacrificial release process