A conduction cooled chassis offers the highest degree of reliability. At ACT, we work with our customers to find the best options to reduce conduction gradients and meet thermal, mechanical and environmental requirements.

Conduction cooling is defined as the transfer of heat through solids. A common example of this is the conduction cooled chassis mounted onto a cold plate as shown in the below figure. Heat generated inside the chassis by the electronics flows into the chassis aluminum sidewalls and down into the cold plate.

LCR Embedded Systems offers a full range of rugged ATR chassis solutions, including conduction-cooled VPX, air-cooled VPX, and liquid-cooled VPX ATR designs, built to withstand the harshest defense and aerospace environments.

Wakefield Thermal’s VPX 3U Conduction Cooled Chassis are used in various harsh rugged and defense applications. These applications include shipborne, airborne, and ground mission critical equipment.

Thanks to this standard, conduction cooled boards and chassis selected from different vendor catalogues all work together. This IEEE standard mainly defines the mechanical dimensions and thermal interfaces for eurocards like VMEbus or other form factors such as CompactPCI.

Conduction-cooled VPX enclosures with liquid assist. The LoC-600 is an ATR chassis designed to maintain safe operating temperatures for high power 3U VITA 48.2 based systems.

The VTX989 is a five slot 3U VPX conduction cooled chassis. The chassis can accept four standard 3U VPX conduction cooled modules with 5HP pitch. The P2 connector location is populated with a 8-position VITA 67.2 coaxial/RF module for the first four modules (the backplane can be modified to meet any of the VITA specifications).

Trident offers a wide range of ATR chassis that are convection, conduction cooled, forced air conduction cooled and liquid cooled. Built with aero-grade aluminum, the chassis are suitable for rugged onboard/mobile applications and can operate under …

KTK’s conduction-cooled chassis are designed for rugged applications that require optimal thermal dissipation. The chassis are high-precision machined boxes that provide a cold wall to cool and support heat frames without the need for a heat sink.

Mistral's rugged Forced air conduction cooled OpenVPX Architecture chassis designed for aerospace and defense applications combines durability, cooling techniques, and robust performance. This chassis features a sturdy build capable of withstanding harsh environments, including extreme temperatures, shock, vibration, and high altitudes.