
欠电位沉积_百度百科
欠电位沉积(Underpotential Deposition,缩写UPD)是指一种金属可在比其热力学可逆电位正的电位下沉积在另一基体上的现象,是一个与电极/溶液结构密切相关的重要的电化学现象。
Understanding the copper underpotential deposition process at …
2017年9月1日 · This work investigated the Cu UPD process at a strained Au surface using a lock-in technique, and the coupling coefficient ς was quantified. Our findings support the notion that each individual electrode process can be characterized by an independent coupling value of ς.
A new approach on the Cu UPD on Ag surfaces - ScienceDirect
2008年9月1日 · Although it is known that a Cu UPD fails on bulk silver substrates, it could be proved that on silver monolayers copper ions are reduced in the underpotential region forming an Au–Ag–Cu sandwich structure. This process occurs only in absence of anions and thymine which are specifically adsorbed on the silver substrate.
Surface characterization of copper electrocatalysts by lead ...
2021年9月1日 · Herein, we evaluate the lead (Pb) underpotential deposition (UPD) on well-defined Cu electrode surfaces in presence of chloride, as a tool to analyse the surface state and determine the presence and distribution of domains on Cu catalysts. A polycrystalline Cu electrode was specifically modified by applying different electrochemical pre-treatments.
Effects of anions on the underpotential deposition behavior of Cu …
The process of Cu underpotential deposition (UPD) on polycrystalline Pt (pc Pt) has been investigated by cyclic voltammetry, chronoamperometry and electrochemical impedance spectroscopy techniques using (bi)sulfate and perchlorate (with/without the addition of a small amount of NaCl) as supporting electrolytes, res
从深共晶溶剂中铜的过电位和欠电位沉积:Pt (1 1 1) 单晶与多晶 Pt …
The process of Cu underpotential deposition (UPD) on the surface of Pt (1 1) in DES is observed for the first time. It is proposed that a complete (1 × 1) monolayer of Cu adatoms is formed at potentials more positive than the onset of overpotential deposition (OPD).
Unconventional Electrochemical Behaviors of Cu Underpotential ...
2023年4月7日 · In this work, we investigate the UPD behaviors of Cu on the Au (111) electrode in a chloride-based deep eutectic solvent ethaline by in situ scanning tunneling microscopy (STM). Benefiting from the properties of the ultraconcentrated electrolyte, we directly image not only Cu but also Cl adlayers by finely tuning tunneling conditions.
Cu UPD表征形状和尺寸受控的Pd纳米颗粒的表面结构:定量方法 …
2019年8月17日 · 根据Pd单晶上的Cu UPD结果,提出了一种新方法来定性和定量确定存在于不同形状和尺寸控制的Pd纳米颗粒表面的 {100}, {111}和 {110}表面域的百分比。 报告的结果清楚地表明,这种Cu UPD的好处是可以根据纳米粒子的颗粒形状和大小获得其表面结构的详细信息。
通过 Cu upd 和 CO 氧化测定多晶和纳米颗粒电极的活性表面 …
对于部分被 Se 覆盖的表面,通过循环伏安法在氢区测量的电荷与质谱测定的 CO2 量的比较表明后者可用于确定未被 Se 覆盖的区域。 另一方面,Cu upd 也发生在完全被 Se 覆盖的表面上;只要不超过全覆盖率的 70%,Cu 解吸电荷与 Pt 和 Ru 改性
Frontiers | Surface Structure Characterization of Shape and Size ...
2019年7月30日 · Based on the Cu UPD results on Pd single crystals, a new approach is proposed to qualitatively and quantitatively determine the percentages of {100}, {111}, and {110} surface domains present at the surface of the different shape and size controlled Pd nanoparticles.
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