直接覆铜（Direct Bond Copper，DBC ）陶瓷基板由于具有良好的导热性能和导电性能成为重要的电子封装材料，尤其是在功率模块（IGBT）和集成电力电子模块中。 目前功率半导体器件所 …

2008年6月17日 · Abstract: In a typical power electronics package, a grease layer forms the interface between the direct bond copper (DBC) layer or a baseplate and the heat sink. This …

Abstract: This article studies the impacts of the bottom copper layer of direct-bond copper (DBC) substrates on the partial discharge (PD) performance of the power modules. Finite element …

2003年3月1日 · Characteristic features of DBC substrates are thick solid copper conductors (0.15–0.65 mm) with a strong adhesion to the alumina or aluminum nitride base >65 N/cm. …

The chips are arranged on insulating direct-bonded-copper (DBC) layers within the module. Each set of paralleled IGBT chips shares a DBC layer structure with its free wheeling diode...

Direct Bonded Copper (DBC) are produced by high temperature (>1000 °C) bonding between copper and a ceramic (usually alumina). They are commonly used in power electronics.

2015年1月1日 · 3-D power module structures allow for better cooling and lower parasitic inductances compared with the classical planar technology. In this paper, we present a 3-D …

Abstract: In this paper, the failure mechanisms of the direct bonding copper (DBC) substrate under the condition of temperature cycling are studied. The cyclic temperature considered …

2017年12月1日 · Direct-bonded-copper (DBC) substrates are commonly used in power electronics, because they both offer good thermal conductivity (24 to 180 W/mK) and suitable …

2016年1月1日 · An optimal structural design of direct bonding copper (DBC) substrate with ladder shaped copper layers was proposed through numerical optimization approach in this paper. In …