Hybrid Bonding是近几年被叫响的，在之前业界通常称其为DBI（Direct Bond Interconnect，直接键合连接），它是在20世纪80年代中期由Paul Enquist，Q.Y. Tong和Gill Fountain在三角研究所（RTI）的实验室首次构思，DBI因其优雅和简洁而成为键合大海上的明灯。 他们三个后来在2000年成立了一家叫Ziptronix的公司，并于2005年实现了10um bump间距用DBI技术连接的铝布线层，接着又在2011年发布2um bump间距用DBI技术完成wafer to wafer 连接。 2015 …

2023年9月13日 · 将两片以上不相同的晶圆通过金属互连的混合键合工艺（hybrid bonding），来实现三维集成，已经在集成电路工业上开始规模应用了。 最先采用这一技术手段的是 CMOS图像传感器 （image sensor），然后就延伸到3D NAND闪存工艺中，最杰出的代表是我国的长江存 …

Abstract: The direct bond interconnect (DBI®) Ultra technology, a low-temperature die-to-wafer (D2W) and die-to-die (D2D) hybrid bond, is a platform technology to reliably achieve submicron interconnect pitches. A reliable D2W and D2D assembly with submicron pitch capability will enable widespread disaggregation and chiplet architecture ...

混合键合（Hybrid Bonding）是半导体封装领域的新兴技术，能够实现高密度三维集成，无需传统的焊料凸点。 本文探讨混合键合的基本原理、相比传统方法的优势，以及该领域的最新发展。

2019年5月25日 · Though DBI (Direct Bonding Interconnect) wafer to wafer has been widely reported and already implemented in the industry, in this talk, we will focus on die to die and die to wafer assembly, its reliability and readiness to enter the market applications where the stacking yield is paramount.

DBI® is a low temperature hybrid direct bonding technology that allows wafers to be bonded with exceptionally fine pitch 3D electrical interconnect. The DBI alignment and bonding process is performed at room temperature.

DBI wafer-to-wafer hybrid bonding is ideal for smaller, high yielding die-like image sensors, antenna switches and, more recently, 3D NAND. In contrast, DBI Ultra die-to-wafer hybrid bonding is suitable for larger die, such as DRAM, microprocessors, graphics …

The Direct Bond Interconnect (DBI® Ultra) technology is a low temperature die to wafer (D2W) and die to die (D2D) hybrid bonding technology that solves many challenges with pitch scaling in advanced packaging.

Adeia’s DBI® hybrid bonding technology delivers up to 10,000 times higher interconnect density per area compared to conventional micro-bump technology, significantly boosting chip connectivity. The ultra-fine interconnect lowers inductance, capacitance, and resistance to enhance overall performance and power efficiency.

Abstract— The direct bond interconnect (DBI®) technology is a platform technology that offers a hermetically sealed hybrid bond with solid metal-metal (Cu-Cu is the most common) interconnect at a relatively low thermal budget. The Xperi wafer …