
QFN/DFN Application Note - 技術支援 - 晶致半導體 - AMtek SEMI
Fig.2: DFN (Dual Flat No-lead) 只有兩邊有內引腳 – DFN 3x3 10L 此種裝件係直接將引腳 (Lead)外露於封裝件之膠體下面,不似傳統封裝件,如 QFP(Quad Flat Package)之引腳從膠體外側延伸,從而減少 PCB 面積的佔用,因而有輕、薄、短、小 的特徵。
下表列出紘康的QFN (Quad Flat No-Lead) / DFN (Dual Flat No-Lead)系列 封裝的封裝尺寸(Body size)、引腳間距(Lead pitch)、I/O數(Lead count) 紘康QFN/DFN系列封裝介紹 PKG Body size (mm) Lead pitch (mm) Lead count picture 6 8 12 16 24 …
various DFN packages. For I/O lead solder land design, we suggest to use a Non Solder Mask Defined (NSMD) approach, remain a small amount of solder mask between the I/O leads to avoid solder bridging. The outward extension can be increased beyond 0.15 mm as this could potentially improve this external solder joint. The minimum inward extension ...
AONR21357 Alpha & Omega Semiconductor Inc. | Discrete …
Order today, ships today. AONR21357 – P-Channel 30 V 21A (Ta), 34A (Tc) 5W (Ta), 30W (Tc) Surface Mount 8-DFN-EP (3x3) from Alpha & Omega Semiconductor Inc.. Pricing and Availability on millions of electronic components from Digi-Key Electronics.
DFN3x3-Package-大中积体电路股份有限公司
依据欧盟施行的个人资料保护法,我们致力于保护您的个人资料并提供您对个人资料的掌握。 按一下「全部接受」,代表您允许我们置放 Cookie 来提升您在本网站上的使用体验、协助我们分析网站效能和使用状况,以及让我们投放相关联的行销内容。
- [PDF]
DFN 3x3 - AOSMD
AON3402 Symbol Min Typ Max Units BV DSS 20 V 10 T J =55°C 25 I GSS 10 mA BV GSO ±12 V V GS(th) 0.5 0.78 1 V I D(ON) 40 A 10.3 13 T J =125°C 14.4 18 14.3 17 mW 21.7 26 mW g FS 37 S V SD 0.73 1 V I S 4.8 A C iss 1810 pF C oss 232 pF …
N-Channel, DFN6 3X3 mm 20 V, 5.8 A/4.6 A Features • Exposed Drain Package • Excellent Thermal Resistance for Superior Heat Dissipation • Low Threshold Levels • Low Profile (< 1 mm) Allows It to Fit Easily into Extremely Thin Environments • This is a Pb−Free Device Applications • DC−DC Converters (Buck and Boost Circuits ...
AONR36368 Alpha & Omega Semiconductor Inc. | 離散式半導體產 …
今日訂購,今日出貨。Alpha & Omega Semiconductor Inc. 的 AONR36368 – N 通道 30 V 23A (Ta)、32A (Tc) 4.1W (Ta)、24W (Tc) 表面黏著式 8-DFN-EP (3x3)。DigiKey 提供數百萬款電子元件的價格及供貨情況。
FDMC8026S-VB一款DFN8(3X3)封装 MOSFET参数应用解析 - CSDN …
2023年10月10日 · DFN封装特点:DFN:体积上,较SOT-23大,但小于TO-252,一般在低压和30A以下中压MOS管中有采用,得益于产品体积小,主要应用于DC小功率电流环境中。MOSFETMOSFET(Metal Oxide Semiconductor Field Effect Transistor-金属氧化物半导体场效应晶体管)是一种半导体器件,广泛用于开关目的和电子设备中电子信号的放大。
DFN 3x3 | LED产业的领导厂商 | 亿光电子 - EVERLIGHT
DFN 3x3 Introducing the Everlight Si Power Devices, renowned for their mature manufacturing technology, exceptional controllability, high voltage tolerance, and outstanding reliability. The Everlight Si Power Device series encompasses a wide range of products, all packaged in the reliable and industry-standard TO-Series format.