Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate.

QFN/DFN (Quad Flat No-Lead/Dual Flat No-Lead)是使用傳統導線架 (Lead frame)且接 近晶片尺寸封裝件 (CSP ,Chip Size Package)之一種先進的塑膠封裝件。 如 Fig.1 & Fig.2 所示。 此種裝件係直接將引腳 (Lead)外露於封裝件之膠體下面,不似傳統封裝件,如 QFP (Quad Flat Package)之引腳從膠體外側延伸,從而減少 PCB 面積的佔用,因而有輕、薄、短、小 的特徵。 如 Fig.3 & Fig.4 所示,係 QFN/DFN 產品與相對應傳統產品的尺寸比較。

Various onsemi components are packaged in an advanced Dual or Quad Flat−Pack No−Lead package (DFN/QFN). The DFN/QFN platform represents the latest in surface mount packaging technology. It is important to follow the suggested board mounting guidelines outlined in …

2015年7月14日 · This package application note provides the guidelines for the handling and assembly of Microchip QFN and DFN packages during the Printed Circuit Board (PCB) assembly. In addition, it provides general information for the …

2024年11月28日 · 作为技术先进的芯片封装形式，dfn封装和qfn封装具有共同点，那就是它们都是无引脚表面贴装封装结构，它们均具有现代底部排放和顶部嵌入式封装的特点，它们都具有体积小、易于集成、一致性好、小型化、轻量化和薄型化等优点，它们的底部通常具有较好的 ...

DFN / QFN是一種方形扁平無釘腳封裝形式，因此封裝體積小、重量輕，並具有良好的電氣和熱性能。 DFN (Dual Flat No Lead Package) : 產品兩側有腳且其腳高度小於0.025mm。 TDFN (Thin Profile Dual Flat No Lead Package)：產品總高為0.8mm以上、1.0mm以下。

The Dual Flat No Leads package, or DFN, is a very small square-shaped or rectangular surface-mount plastic package with no leads. Metal pads or lands along two sides of the bottom of the DFN package serve as electrical connection points to the outside world.

Dual Flat No Lead (DFN) is a very small square-shaped or rectangular surface-mount plastic package with no leads, near chip scale package (CSP) with a low profile, moderate thermal dissipation, and good electrical performance. Metal pads or lands along two sides of the bottom of the package serve as electrical connection points to the outside ...

DFN - Dual Flat No Leads Package Series using the right amount of solder paste for proper stand-off and solder meniscus for use in automotive, industrial and mobile applications.

For small, low pin count products, these leadless packages are known as DFN (Discrete Flat No leads)packages. The diversity of DFN packages is still growing. There are several advantages of DFN packages compared to conventional leaded (SO) packages.