2020年1月8日 · This study aims to conduct a thorough investigation of the die shift of the reconstituted molded wafer for fan-out wafer level packaging (FOWLP) during the fabrication process.

2016年5月1日 · Die shift is a critical issue in compression molding process for fan-out wafer level packaging (FOWLP). A comprehensive investigation has been performed using the developed multi-step simulation...

Taking into account this shifting trend, in this paper, we propose an alleviation methodology integrating two novel approaches to alleviate the die shift problem. The experiments show that the die shift of 12- and 18-inch FOWLP can be alleviated and the yield will be highly improved.

2021年12月3日 · 扇出型晶圆级封装通过圆片/晶圆重构增加单个封装体的面积，应用硅通孔（TSV）、凸点（Bumping）等先进制造工艺完成多层再布线和凸点制备，切割分离后得到能够与外部电性能互连的封装体。 2010年，有行业研究机构就已经指出未来FoWLP封装主要是替换更高I/O（>1000引脚）的BGA封装型式。 扇出型晶圆级塑封前后对比. 据麦姆斯咨询报道，近期，富仕三佳机器有限公司汪洋等人在《模具制造》期刊上发表了以“扇出型晶圆级塑封过程中芯片偏 …

2016年3月29日 · The die shift caused by the EMC flow drag force is evaluated from the data on die movements due to thermal contraction/expansion and warpage. The relationship between the die shift and variation in the die gap is determined through regression analysis in order to predict the die shift due to the flow drag force.

The diversified system requirements have been continuously growing to drive the development of a variety of new package styles. Wafer-Level Packaging (WLP) tech.

A new process that can improve die shift issue in process utilising back-sided under bump metallurgy (UBM) via a self-alignment effect for fan-out package applications is proposed.

2013年9月30日 · Die shift issues that arise in embedded wafer-level packaging because of the mold flow process is investigated in this paper, along with solution strategies to address them.

2022年9月16日 · Die shift in fan-out wafer-level packaging (FOWLP) is a major roadblock, limiting package scaling and performance. It not only limits the wire pitch but also re

介绍了近10年来扇出型晶圆级塑封压缩成型工艺对制品性能,尤其是芯片偏移 (die-shift)的影响。 从工艺、材料和设备等方面进行了参数化研究,并提出了扇出型晶圆级塑封设备的设计要求。