2019年2月28日 · EVG BONDSCALE旨在实现各种融合晶圆键合应用，包括工程衬底制造和使用层转移处理的3D集成方法，如单片3D（M3D）。 凭借BONDSCALE，EVG将晶圆键合引入前端半导体处理，并帮助解决国际设备和系统路线图（IRDS）中确定的“深度摩尔”逻辑器件扩展的长期挑战。

Highly flexible welding lines for the production of special sheets and engineered fabric of any configuration. Welding lines of different degrees of automation for the production of reinforcing steel sheets in small and medium lot sizes.

使用EVG先进的OmniSpray涂层技术，在3D结构晶圆上实现光刻胶或聚合物的共形层，用于互连技术。 这确保了高粘度光致光刻胶或聚合物的低材料消耗，同时改善了均匀性并防止了扩散。

EV 集团(EVG) 在中国国际半导体展上展示新型晶片到晶圆混合键合活化解决方案,旨在加快3D-IC/异构集成技术的发展 EVG®320 D2W 晶片准备和活化系统可与第三方晶片键合机无缝集成;EV 集团(EVG) 还与ASM Pacific Technology合作,提供晶片到晶圆混合键合解决方案

供應商EV Group(EVG), 今天宣布推出EVG®7300自動化SmartNIL® 奈米壓印與晶圓級光學系統。EVG7300 是EVG最先進的解決方案,可在單一平台上結合如奈米壓印微影技術(NIL )、透鏡壓鑄與透鏡堆疊(UV接合)等多重基於UV架構的製程。這套隨時可供業界使用的多功能系統,旨在滿足 ...

Discover how we shape the future of production through cutting-edge technology and continuous development. INSIDE EVG 2025, Raaba/Graz 4.-14. April 2025. As a globally operating …

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With the invention of the world's first double sided alignment system in 1985, EV Group has revolutionized MEMS technology and set worldwide industry standards in aligned wafer bonding by separating the alignment and bonding process. This process separation results in higher flexibility and universal application of the wafer bonding equipment.

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EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the latest version of its EVG120 automated resist processing system.