TO-252, also known as DPAK [1] or Decawatt Package, is a semiconductor package developed by Motorola [2] for surface mounting on circuit boards. [3] It represents a surface-mount [4] variant of TO-251 package, and smaller variant of the D2PAK package. It is often used for high-power MOSFETs and voltage regulators.

Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. On this page you can find the …

Package. PG-TO252-3-11_Interactive 3D_01 Share. 02_00 | Jul 31, 2024 | STP | 282 kb. PG-TO252-3-11_Interactive 3D Share. 02_00 | Jul 31, 2024 | PDF | 80 kb

Dimension D, and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at the outermost extremes of the plastic body. THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE.

Determined by component size. The clearance between the component and the cavity must comply to the rotational and lateral movement requirement provided in figures in the "Maximum

DPAK (TO-252) package, MOSFETs manufactured by Vishay, a global leader for semiconductors and passive electronic components.

2021年10月19日 · The Decawatt Package (DPAK), also known as TO-252, is a semiconductor package developed by Motorola for surface mounting on printed circuit boards (PCBs). It represents a surface-mount variant of TO-251 package, and …

7.0 (0.276) 1.5 (0.059) 2.3 (0.090) 2.5 2.3 (0.090) 1.5 (0.059) 6.9 (0.272) D-Pak (TO-252) Footprint 7.0 (0.276) All dimensions in mm (inches)

These N-channel Power MOSFETs utilize STripFET F7 technology with an enhanced trench gate structure that results in very low on-state resistance, while also reducing internal capacitance and gate charge for faster and more efficient switching. For further information contact your local STMicroelectronics sales office. Table 1.

On this page you can find the dimensions and packing method for Toshiba Semiconductor's DPAK package.