TO-252, also known as DPAK [1] or Decawatt Package, is a semiconductor package developed by Motorola [2] for surface mounting on circuit boards. [3] It represents a surface-mount [4] variant of TO-251 package, and smaller variant of the D2PAK package. It is often used for high-power MOSFETs and voltage regulators.

Download schematic symbols, PCB footprints, 3D Models, pinout & datasheet for the L78M12ABDT by STMicroelectronics. Linear Voltage Regulator IC Positive Fixed 1 Output 500mA DPAK. Exports to OrCAD, Allegro, Altium, PADS, Eagle, KiCad, Diptrace & Pulsonix.

2018年4月18日 · I am using a DPAK power component and an SMD heatsink intended for use with a DPAK device (i.e. DigiKey: HS407-ND). I am curious what the best practice is for creating a schematic symbol and PCB footprint for this?

These N-channel Power MOSFETs utilize STripFET F7 technology with an enhanced trench gate structure that results in very low on-state resistance, while also reducing internal capacitance and gate charge for faster and more efficient switching. For further information contact your local STMicroelectronics sales office. Table 1.

TO-252 (DPAK), TO-251 = ESD Symbol LL = Lot Code = Siliconix Logo T = Assembly Factory Code Y = Year Code W = Week Code F = Wafer Fab Code = Mold Dimple (Q)06N10-225L LL Example Part Numbers In Red Type Q = Automotive, for example for SQD45N05-20L. No character otherwise, for example for SUD45N05-20L T Y W F TO-251

This dual Schottky rectifier is designed for switch mode power supplies and other power converters. This device is intended for use in low and medium voltage operation, and in particular high frequency circuits where low switching losses are required (free wheeling and polarity protection). This is information on a product in full production.

2021年10月19日 · The Decawatt Package (DPAK), also known as TO-252, is a semiconductor package developed by Motorola for surface mounting on printed circuit boards (PCBs). It represents a surface-mount variant of TO-251 package, and …

2024年6月4日 · DPAK（TO-252）是一种常见的表面贴装封装，广泛用于功率半导体器件如晶体管、场效应管（MOSFET）和稳压器。 它的尺寸适中，具有良好的散热性能和较高的功率处理能力。 D2PAK（TO-263）是一种更大的表面贴装封装，适用于更高功率的半导体器件。 它通常用于高功率的晶体管和功率模块，具有更大的散热能力和功率处理能力。 DPAK和D2PAK都是常见的功率半导体器件封装类型，主要区别在于尺寸和功率处理能力。 DPAK适用于中等功率应用， …

DPAK E • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 4

Surface mount packages enhance circuit performance by reducing stray inductances and capacitance. The DPAK (TO-252) surface-mount package brings the advantages of power MOSFET’s to high volume applications where PC Board surface mounting is desirable. The surface mount option IRFR9012, SiHFR9012 is provided on 16 mm tape.