Photolithography (also known as optical lithography) is a process used in the manufacturing of integrated circuits. It involves using light to transfer a pattern onto a substrate, typically a silicon wafer. The process begins with a photosensitive material, called a …

ASML's deep ultraviolet (DUV) lithography systems dive deep into the UV spectrum to print the tiny features that form the basis of the microchip. Our immersion systems lead the industry in productivity, imaging and overlay performance for high-volume manufacturing of the most advanced Logic and Memory chips.

With lithography optics from ZEISS SMT (no sales in Germany), chip manufacturers worldwide can expose with nanometer precision – in the range of "deep ultraviolet light" (DUV light) with …

光刻机分为紫外光源（UV）、深紫外光源 (DUV)、极紫外光源（EUV）。 按照发展轨迹，最早的光刻机光源即为汞灯产生的紫外光源（UV）。 之后行业领域内采用准分子激光的深紫外光源（DUV），将波长进一步缩小到ArF的193…

2025年1月23日 · For more than 50 years, DUV technology has made it possible to combine the increasing demand for high-performance microchips with cost-efficient production – laying the foundation for digitalization. Together with EUV and High-NA-EUV lithography, it sets the pace for a connected, digital future.

DUV技术用于光刻是完全基于投影光学的自模上的掩模比最后在光刻胶上显现的图案大得多。 光学系统. 193纳米光刻工具被称为 折射率光学系统。 这个术语意味着它使用了两个镜头（折射)和反射 (反射)元件，用于引导和调节来自激光的光。 细节后面文章中会单独细聊. 这种系统的优点是它能适应较宽的光源带宽限制色差。 光学系统中的折射元件由两种合成材料制成. 熔融二氧化硅或氟化钙，材料对193nm光的低吸收。 光掩模 (或十字线)在这些系统通常是由熔融二氧化硅与铬图 …

Photolithography at DUV wavelengths has come a long way to enable 40-nm structure sizes with the development and introduction of aspherical optics, tightened budgets and implementation of ...

DUV和EUV最大的区别在光源方案。 EUV的光源波长为13.5nm，但最先进DUV的光源波只有193nm，较长的波长使DUV无法实现更高的分辨率，因此DUV只能用于制造7nm及以上制程的芯片。

DUV processing allows very little substrate non-flatness due to the very limited depth of focus. Your substrates should ideally be Ultra-Flat Wafers (TTV <2um). If not, there may be focus variations within single die. Note that CNF does not sell Ultra-flat wafers at this time.

DUV lithography is a well-established lithographic process that allows users to transfer patterns on a substrate (e.g. SOI) with the use DUV light on a photomask (reticle). DUV is based on projection optics, since the pattern on the reticle is much larger than the …