Dymalloy is a metal matrix composite of 20% copper and 80% silver alloy matrix with type I diamond. [1] It has a very high thermal conductivity of 420 W/(m·K), and its thermal expansion can be adjusted to match other materials, e.g., silicon and gallium arsenide chips.

1995年6月29日 · We have developed Dymalloy, a copper-diamond composite, that has a thermal conductivity of 420 W/mK and an adjustable coefficient of thermal expansion, nominally 5.5 ppm/C at 25 C, compatible with silicon and gallium arsenide.

We have developed a copper-diamond composite material, named Dymalloy, with a thermal conductivity of 420 W/m/spl middot/K, better than copper, and an adjustable coefficient of thermal expansion, nominally 5.5 ppm//spl deg/C at 25/spl deg/C, …

Dymalloy, made with 55 ~01% diamond, has a perfect CTE match to gallium arsenide. Note that siightly increasing the diamond volume fraction allows the CTE to be adjusted to provide a perfect match to silicon. Values of the thermal conductivity and CTE of common semiconductor and substrate materials are shown in Table 1.

Dymalloy is a metal matrix composite consisting of 20% copper and 80% silver alloy matrix with type I diamond. It has very high thermal conductivity of 420 W/(m·K), and its thermal expansion can be adjusted to match other materials, e.g. silicon and gallium arsenide chips.

Dymalloy is a metal matrix composite of 20% copper and 80% silver alloy matrix with type I diamond. It has a very high thermal conductivity of 420 W/(m·K), and its thermal expansion can be adjusted to match other materials, e.g., silicon and gallium arsenide chips.

Description/Abstract High power density electronic components such as fast microprocessors and power semiconductors must operate below the maximum rated device junction temperature to ensure reliability. function temperatures are determined by the ...

2024年10月22日 · 让我们深入了解关于Dymalloy的40个有趣的事实！ 什么是Dymalloy？ Dymalloy是一种复合材料，以其独特的混合性能而闻名。它结合了铜和氧化铝，使其成为各种高科技应用的热门选择。让我们来探索一些关于这种迷人材料的有趣事实。 起源故事Dymalloy诞生于20世纪60年代。

1998年6月22日 · The purpose of this research was to test the commercial viability and feasibility of Dymalloy, a composite material to measure thermal conductivity. Dymalloy was developed as part of a CRADA with Sun Microsystems. Sun Microsystems was a potential end user of Dymalloy as a substrate for MCMS.

1998年6月22日 · The purpose of this research was to test the commercial viability and feasibility of Dymalloy, a composite material to measure thermal conductivity. Dymalloy was developed as part of a CRADA with Sun Microsystems.