2021年1月29日 · On-chip ESD protection structures protect the input, output, and power supply pins of the core circuit by providing a safe ESD discharge path to the ground bus/rail.

2024年12月13日 · Electrostatic discharge (ESD) failure remains a major integrated circuit (IC) reliability challenge. Though devices being the foundational elements, on-chip ESD protection design is essentially a complex full-chip design task.

静电放电（ESD）是一种瞬间释放电荷的现象，发生在两个带电物体靠近时，其间的静电会迅速转移。 这种放电可以产生非常高的电流（可达数十安培）和电压（可达数万伏），可能导致集成电路部件受损或性能下降。 为了评估和测试集成电路中的ESD保护电路，我们使用多种ESD测试模型来模拟这些放电事件，这些模型是根据放电的来源进行分类的。 人体模型（Human body model, HBM）是用来模拟当人体带电并直接触碰电子设备时，可能引发的静电放电（ESD）现象。 …

2022年3月29日 · Electrostatic Discharge (ESD) events occuring during the manufacturing and assembly of semiconductor devices can easily damage integrated circuits. Advanced processes like 40nm, 22nm or FinFET circuits are very vulnerable for ESD stress. Therefore, IC designers insert on-chip ESD protection devices at every chip interface of their design.

2001年9月1日 · As IC technologies advance into the VDSM region, area-efficiency becomes the number one concern in ESD design in order to simultaneously achieve superior ESD robustness and low ESD parasitic effects on circuit performance.

System-level protection for electrostatic discharge (ESD) is crucial in today’s world, not only in the industrial space but also in the consumer and automotive space. It only takes one ESD strike to permanently damage a product, which makes ESD protection a critical component in a …

Electrostatic discharge (ESD) is an event that sends current through an integrated circuit (IC). This paper reviews the impact of ESD on the IC industry and details the four stages of an ESD event: (1) charge generation, (2) charge transfer, (3) device response, and (4) device failure.

Electrostatic discharge (ESD) failure is a major integrated circuit (IC) reliability problem. On-chip ESD protection has drawn continuous R&D efforts for decades and becomes increasingly challenging for modern chips at advanced technology nodes where ESD protection device structures play foundational roles.

2023年11月15日 · Electrostatic discharge (ESD) can cause malfunction or failure of integrated circuits (ICs). On-chip ESD protection design is a major IC design-for-reliability (DfR) challenge, particularly for complex chips made in advanced technology nodes.

ESD can occur in any one of four different ways: a charged body can touch an IC, a charged IC can touch a grounded surface, a charged machine can touch an IC, or an electrostatic field can induce a voltage across a dielectric sufficient to break it down.